Clean Technology 2010
H.J. Kim, B. Han, W.S. Oh, T. Oda, Y.J. Kim
Korea Institute of Machinery and Materials, KR
semiconductor, ultrafine, electrostatic precipitator, particles, anti-corrosive
Current electrostatic precipitators (ESPs) for removing particles from semiconductor industries have used costly anti-corrosive metallic materials to maintain the particle removal performance. Due to the economical demand of the industries, a novel ESP has been developed whose charger is made of carbon fibers and collection plates of PET films in which an aluminum sheet was inserted. The ESP was evaluated by changing applied voltages to chargers and collection plates, and flow rates. Ultrafine KCl particles were used, and a scanning mobility particle sizer was used to measure the particle number concentrations before/after the ESP. The Experimental results showed that the collection efficiency decreased linearly as face velocity increased. However, higher applied voltages to the ionizers and collection plates enhanced the efficiency up to over 80%. In addition, there is a linear correlation between the applied voltages and collection efficiency. In particular, the linear coefficient of the applied voltage to ionizers was approximately two times higher than that of the voltage to collection plates. These results suggest that the novel anti-corrosive ESP can remove ultrafine particles from semiconductor manufacturing process effectively and its performance can be improved even at high flow rates by simply changing applied voltages to the ESP.