The Design and Fabrication of Reflector Array for Multi- Chip LED Lamp
H. Jeong, B. Jung, S. Han, E. Song, S. Park and J. Lee
Koera Institute of Energy Research, KR
LED(Light Emitting Diode), Reflector
We designed the bottom opened reflector to apply to LED such as Fig. 1. This structure has advantage to low junction temperature of LED, because LED and heat sink are connected directly. We fabricated the reflector using MEMS(Micro Electro Mechanics System) fabrication process. Because it is hard to make the reflecting surface to use common manufacturing technology. This packaging structure has an advantage to reduce thermal resistance of LED lamp, because LED chip and heat sink are connected directly. And the reflective performance of the micro reflector was improved to 90%(Fig. 2), and we fabricated a LED with this reflector in Fig. 3.
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