TechConnect interviews the "Inkjet" Symposium Chair, Chris Menzel, a Principal Technologist, at FujiFilm Dimatix. The symposium will take place at the TechConnect World Innovation Conference in May 2017.
Deadline: Feb 14, 2017
Deadline: Feb 01, 2017
Learn about TechConnect's Micro & Bio Fluidics, Lab-on-Chip (LOC) Symposium and the greatest areas of interest and possible applications in the field. Dr. Edward Furlani of the University at Buffalo will be chairing the symposium.
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NSTXL is pleased to host the 2017 Defense Innovation Challenges, delivering transformational technologies to our National Defense. Oct. 3-5, 2017 in Tampa, Florida.
Delivering transformational solutions to our National Defense. Top ranked Innovations will showcase their technology to defense and corporate developers: July 19-20, 2017, Honolulu, HI